职责描述：1.CommunicatedirectlytoCustomer2.Authoritytogiveinstructionsandguidancetotechnicalsubordinates3.Projectmanagement4.Planoutyourprocessandprovidesupporttotheotherdepartmentsinvolved.5.ToolInstallationandQualificationofToolsandancillaryequipment6.SustainandimprovementprocessesStability7.ReviewnewproductsdesignandoptimizeprocessparametertoachieveLTandHVMperformance任职要求：1.Degreefromuniversityorhighertechnicalcollege,chemicalorengineeringbackground,masterdegreeperfer.2.ProcessengineeringexperienceinIC-Substrate,HDI-PCB,Assembly,IC-Packagingorrelatedindustry;3.KnowledgeofqualitytoolslikeSPC,MSA,DOE,FMEA,CP,etc.4.Goodanalyticalskillswithattentiontodetails.5.Goodstressmanagementskills6.Knowledgeofprojectmanagement,dataevaluationanddesignofexperiments7.FluentwrittenandoralEnglish(Mandarinwouldbeofadvantage)8.Goodteamworkingspiritandownership9.Goodcommunicationandnegotiationskills10.Computerskills–MSOfficePackage(Word,Excel)职能类别：半导体技术
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